Thermal pad Gelid Solutions GP-Ultimate Thermal Pad 120x20x1.5 mm (TP-GP04-R-C)

The GP-Ultimate 120x20 heat-conducting spacer is intended for installation on printed circuit boards with elements of various sizes and topologies, such as RAM and ROM chips, chipsets, analog chips, VRM power circuits, other integral and discrete components of surface mounting.

Due to high elasticity, GP-Ultimate 120x20 covers the electronic components, filling the gaps between them. And the increased thermal conductivity of the gasket ensures highly efficient heat transfer to one or more radiators mounted on the printed circuit board. The extended operating temperature range -60 ° C - 220 ° C also allows the use of GP-Ultimate 120x20 in industrial electronics devices.

The GP-Ultimate 120x20 gasket is made in the form of a 120x20 mm plate and is optimally suitable for memory modules, VRM power circuits of motherboards and video cards, high-speed M.2 drives Type SSD and other electronic devices with dense surface mounting.

Features:

• Extreme thermal conductivity of 15 W / mK
• High elasticity
• Not prone to corrosion, non-toxic, fire-resistant
• Optimum for memory modules, VRM power schemes, M.2 Type SSD drives