Thermal pad Gelid Solutions GP-Ultimate Thermal Pad 120x20x0.5 mm (TP-GP04-R-A)

GP-Ultimate 120x20 heat conductive gasket is designed for installation on printed circuit boards with elements of different sizes and topologies, such as RAM and ROM chips, chipsets, analog chips, VRM power circuits, other integral and discrete surface mount components.

Due to high elasticity, GP-Ultimate 120x20 covers electronic components, filling inequalities between them. And the increased thermal conductivity of the gasket ensures highly efficient heat transfer to one or more radiators mounted on the printed circuit board. The extended operating temperature range of -60 ° C - 220 ° C also allows the use of GP-Ultimate 120x20 in industrial electronics devices.

The GP-Ultimate 120x20 gasket is made in the form of a 120x20 mm plate and is optimally suitable for memory modules, VRM power circuits of motherboards and video cards, high-speed M.2 Type SSD drives and other electronic devices with dense surface mounting.

Features:

• Extreme thermal conductivity of 15 W / mK
• High elasticity
• Not prone to corrosion, non-toxic, fire-resistant
• Optimum for memory modules, VRM power circuits, M.2 Type SSD drives

Characteristics

Manufacturer

Gelid Solutions

They are also looking for

для ноутбука

Country of manufacture

Китай

Purpose

для оперативної пам'яті

type

силіконові

Dimensions

120 х 20 мм

thickness

0.5 мм

Quantity

1 шт

Thermal conductivity

15 W/m.k

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