Thermal pad Gelid Solutions GP-Extreme Thermal Pad 120x20x2.5 mm (TP-GP05-F)

GP-Extreme Thermal Pads are designed to provide an ideal thermal interface for heat transfer to the heatsink when mounted on PCBs with height differences and uneven surfaces, such as microcontroller units, memory ICs, analog ICs, MOSFETs and other SMD components. Thanks to its softness and excellent thermal conductivity, GP-Extreme correctly fills the space and provides the best performance in its class.

• Maximum thermal conductivity
• Non-electrically conductive
• Non-aggressive, non-curable and non-toxic
• Easy to use
• Ideal for RAM, VRM and solid-state storage type M.2.

Gelid Solutions GP-Extreme is designed for perfect thermal contact with the heatsink when mounting on PCBs with height differences and uneven surfaces such as microcontrollers, memory chips, analog chips, MOSFETs and other SMD components. Thanks to its softness and excellent thermal conductivity, GP-Extreme fills the right space and offers best-in-class performance.

GP-Extreme is non-conductive, non-corrosive, non-hardening and non-toxic. GP-Extreme provides ease of use, and the size of the thermal pad is optimally suited for large surfaces of printed circuit boards of VGA cards, laptops, game consoles and other tightly packed devices.

Characteristics

Manufacturer

Gelid Solutions

They are also looking for

для ноутбука

Country of manufacture

Китай

Purpose

для оперативної пам'яті

type

силіконові

Dimensions

120 х 20 мм

thickness

2.5 мм

Quantity

1 шт

Thermal conductivity

12 W/m.k

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